At Lenox Laser, we are at the forefront of innovative solutions for the semiconductor industry's gas handling needs. Our groundbreaking work addresses the critical challenge of achieving precise control over process gases like hydrogen, helium, nitrogen, argon, and oxygen, which are essential in wafer production.
Through extensive research and testing, we have determined that a bell-shaped entrance in orifice design enhances flow control, significantly outperforming sharp-edged designs. Our orifices, verified across a range of sizes from 1.0 to 600 microns, offer unparalleled accuracy in gas flow management. Lenox Laser’s advancements in gas handling technology set new standards for precision and reliability in the semiconductor industry. By utilizing our calibrated orifices, manufacturers achieve superior quality control and cost efficiency in wafer production.
For more information go to www.lenoxlaser.com