A 2004 Laser Study

The laser is the perfect modern-day, precise cutting tool. It is helpful in the production of many products
today – products that range from big to small. The exactness of a laser is its biggest asset. Beyond just helping
the creation of new material, however, the laser can also be used to remove unwanted content from any
surface. This process is known as laser ablation, and it has been pioneered and innovated by Lenox Laser over
our 35 years of service.

Challenging the threshold of what the laser can drill is always is what we do at Lenox Laser. We handle
everything from laser drilling holes as small as 0.5 µm to using a scanning electron microscope or SEM, which
produces images by scanning a surface. Lenox Laser took part in a project in 2004 to help develop the best
method for creating holes via standard thickness substances or more substantial areas. Published in the
Journal of Semiconductor Technology and Science, Lenox Laser was privileged to be a part of this innovative
experiment. The publication can be read here. In this study, the goal was to test laser ablation against the
typical procedure of dry plasma etching in making holes that could work for the designing of transistors, for
example. The conclusion was that not only was laser ablation faster but also did the job with less
contamination in the product.

This experiment was another achievement, and Lenox Laser was proud to take part in and hope that future
contributions such as this continue to change and evolve to exciting new heights and prospects. As we look
back on this, we send our thanks to all that had been helping to make this possible. Here is to many more
breakthroughs in the future. As always, to learn more about our laser drilling processes; and for our services,
please visit.

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